Independent foam urethane pad
Industry standard products in the CMP process of device wafers.
We handle industry-standard urethane pads for device CMP. Based on special polyurethane materials, the unique structure with highly uniform micro-foaming effectively retains slurry while evenly distributing it to the workpiece, demonstrating excellent processing uniformity. Additionally, it achieves high step reduction performance and low scratch performance. 【Product Lineup】 ■ Suitable for high flattening of various substrates - IC1000(TM) single-layer pad ■ Suitable for oxide film CMP and metal CMP - IC1000(TM) SUBA(TM) laminated pad - IC1400(TM) laminated pad ■ VISIONPAD(TM) Next-generation product of IC1000(TM) - VISIONPAD(TM) 6000N laminated pad *For more details, please download the PDF or feel free to contact us.
- Company：アンカーテクノ
- Price：Other
